Where multiple voids exist, the dimensions will be added to calculate total voiding in the joint. Ramp, 0.7 C/sec 237 C peak 15ġ6 Reflow Yield: Application Note Definition of Voiding Performance Reflow Performance Solder Outline Void Outlines Location of Void Class I Class II Class III Void in Solder 60% of diameter 42% of diameter 30% of diameter (Solder Sphere) = 36% of Area = 20.25% of Area = 9% of Area Void at interface of Solder (Sphere) and Substrate 50% of diameter = 25% of Area 25% of diameter = 12.25% of Area 20% of diameter = 4% of Area 0.1d 0.25d IPC Criteria for Voids in BGAs, IPC Example: Total Void Diameter 0.10d +0.25d = 0.35d The IPC criteria provide three classes of acceptance for both the solder sphere and the spherepad interface. Ramp 1.0 C/sec 230 peak Soak 175 C, 240 C peak Str. Alloy SAC405 SAC387 SAC305 SACX Plus 0807 SACX Plus 0307 Solidus Liquidus ( C) C C C C C 14ġ5 Reflow Performance Suggested Reflow Profiles: OM-338 PT 250 Profiles Tested 200 Temperature (C) Time (s) Soak 160 C, 240 C peak Str Ramp 1.5 C/sec 245 peak Str. For alternative alloys, please follow the liquidus temperature of the respective alloy in the table below. Resistance ( ) Point 1 Point 2 ġ4 Reflow Process Guidelines Reflow Performance Extended Reflow Profile Air* Peak temperature : 250 C From 40 C to 220 C: 2min 30sec to 3min 30sec From 170 C to 220 C: 45 to 90 seconds From 130 C to 220 C: from 1min 30 sec to 2min 15 sec Times above liquidus: 30 to 90 seconds Extended Reflow Profile Nitrogen* Peak temperature : 250 C Capable of Soak C: seconds From 40 C to 220 C: 2 min 30 sec to 4 min 30 sec From 170 C to 220 C: 45 to 120 seconds From 130 C to 220 C: from 1min 30 sec to 3 minutes Times above liquidus: 30 to 90 seconds *Above recommendations are for SAC305. Pin Testability >98% Yield (98%) under demanding conditions Pin Tip: Sharp Chisel Pin Force: 6.5 oz (0.18 Kg) Point 1: (1.01mm) pad Point 2: (0.71mm) pad Pad Finishes: HASL and Entek OSP Performance Indicator Minimal residue contamination of pins helps to eliminate false negatives. 25mm/second to 150mm/second (1 inch/second to 6 Print Speed Range inches/second) down to 0.25mm (10 mil) circles and.3mm (12 mil) pitch QFP pads. Tack Life >24 hours Capable of printing in temperatures from 20 C to 30 C (68 F to Temperature Window Print Process Window 86 F) Print Consistancy Repeatable volume deposition and low volume variability (CpK > 2.0) on 0.25mm (10 mil) circles. 3Ĥ Performance Summary Process Benefit OM-338 PT Benefit Performance Capability Fine Feature Print Definition Excellent print definition and consistant volumetric performance to 0.25mm (10 mil) circles and 0.3mm (12 mil) pitch rectangular QFP pads. It s the kind of support you would expect from a company that s remained dedicated to serving the needs of the Global circuit assembly market for over 50 years. With our local teams of technical experts, you can count on Cookson s complete support whenever and however you need us. OM-338 PT passed every major Surface Insulation and Electrochemical Migration test, including Bellcore, IPC, JIS and the HP protocols. Cookson considered what you need from a lead free solder paste high yield fine feature printing with a wide process window, excellent reflow yields with both straight ramp and soak profiles, high electrical reliability AND world class in circuit pin testability. Print Performance Reflow Performance Post Reflow Cosmetics Reliability Summary Techical Bulletin MSDSģ Introduction Introducing ALPHA OM-338 PT, a more pin testable variation of the OM-338 lead-free solder paste family. 1 the product: A world class lead free, high reliability noclean solder paste with best in class incircuit pin testability ALPHA OM-338 PT Solder Paste product guide 1Ģ Welcome to the ALPHA OM-338 PT Product Guide CONTENTS Page # 1.
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